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    Non-destructive testing (NDT) – Don’t break it!



    When a product fails and you want to know what happened, the first thing to do is inspection from the outside. However, the features of interest may be invisible from the outside (internal cracks, delamination, …). In that case, you need to expose the inside by destructive disassembly, cross-sectioning, etching, and so on…, or you can use one of the so-called “non-destructive testing” methods.


    The non-destructive methods have the advantage that the sample is unaltered and all further processing or testing is still possible. Non-destructive techniques are very useful to periodically monitor the integrity of a product during operation or during accelerated lifetime testing. They are also used to locate a failure position, so that a cross section right through the defect can be made.


    The family of non-destructive testing (NDT) methods consists of

    -          X-ray transmission and tomography

    -          Acoustic or ultrasound analysis and microscopy

    -          Magnetic induction and eddy current probes

    -          Liquid penetrant inspection

    -          Magnetic particle imaging

    -          Thermography

    -          and many more


    Some typical failure modes addressed with NDT are

    -          delamination of solder bonds, coatings or adhesives

    -          fracture of bond wires inside an IC package

    -          layer thickness variation of coatings

    -          microcrack formation in constructions with mechanical stress concentrations


    Whenever you need to analyse a failure, or monitor product integrity, NDT should be your first consideration. Innovation Labs Material Analysis can help you choose a suitable method, perform the analysis and advice on the interpretation and follow-up. Next steps may be destructive analysis, e.g. by cross-sectioning and electron microscopy or by mechanical testing (tensile, peel, scratch). All such tests and analyses are available under one roof at Innovation Labs Material Analysis.

    Fracture of stranded wire in an electrical connector, imaged using X-ray transmission.

    Onset of delamination around a back contact (left) during lifetime testing of a laminated PV module (right), imaged from the back using Scanning Acoustic Microscopy.

    Inspection of coating thickness homogeneity on aluminium outdoor furniture, using eddy current probing.

    Your technical contact

    Marcel Verheijen 
    Senior Technologist Advanced Imaging 
    Phone: +31 6 21 17 42 27

    Your general contact

    Ben Broers
    Business Development Manager
    Phone: +31 40 27 48883